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An investigation has been performed on the improved solder wettability of oxidized aluminum (Al) with lead-free solder (96.5Sn-3.5Ag) using Ar-H₂ plasmas. The lead-free solder wettability was raised from 62.2 per cent wetting for Al oxidized in air at 250 C for 4 h to 98.4 per cent wetting of oxidized Al modified by Ar-H₂ plasmas at a certain H₂ flow rate. This study aims to gain insight on the surface characteristics of Al affecting the solder wettability with a liquid lead-free solder.

Ar-H₂ plasmas at certain H₂ flow rates are intended to reduce Al oxides on the surfaces of oxidized Al substrates both by physical bombardments via Ar plasmas and chemical reductions with H₂ plasmas, while Al substrates are exposed in Ar-H₂ plasmas to improve the solder wettability with a liquid lead-free solder.

Surface characteristics of oxidized Al substrates have been identified to play key roles for enhanced lead-free solder wettability using Ar-H₂ plasmas. A decrease in polar surface free energy and an increase in dispersive surface free energy on the surfaces of oxidized Al substrates are exploited to advance the lead-free solder wettability. Decreased composition ratios of O to Al, detected by X-ray photoelectron spectroscopy (XPS) for oxidized Al substrates, are crucial for improved lead-free solder wettability.

XPS is typically used to analyze the surface compositions of Al oxides. To provide a rapid and non-expansive method to identify the surfaces of Al substrates prior to soldering to assure lead-free solder wettability, this study proposes a measurable skill, a so-called sessile drop test method, to investigate surface free energies such as total, polar and dispersive surface free energy on the surfaces of Al substrates, to illuminate how the lead-free solder wettability of oxidized Al is improved by Ar-H₂ plasmas.